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Henkel Adhesive Technologies
Underfills
LOCTITE® 3508NH
One-part, halogen-free epoxy underfill for shock and drop protection
Conformal coatings
LOCTITE® SI 5293
Conformal coating providing environmental protection for electronic components
LOCTITE® ECCOBOND UF 3812
One-part epoxy underfill with excellent thermal performance
Potting compounds
LOCTITE® STYCAST US 2350
Low-viscosity, urethane potting compound
LOCTITE® STYCAST EO 1058
One-part, heat-curing epoxy potting compound
LOCTITE® STYCAST CC 8555
VOC- and solvent-free, UL 746E-rated conformal coating
Fill encapsulants
LOCTITE® ECCOBOND EO 1072
Epoxy dam and fill encapsulant with excellent handling
LOCTITE® STYCAST PC 62
Easily reworkable, fast-drying protection layer for circuit boards
LOCTITE® ECCOBOND UF 1173
One-part, void-free, second level epoxy underfill
Injection molding compounds
TECHNOMELT® PA 646
High-performance, black polyamide offering high strength and hardness
TECHNOMELT® PA 678
Polyamide hotmelt for low-pressure molding applications
LOCTITE® 3517M
One-part, black epoxy underfill for preventing mechanical stress